·Mini Flip COB(Chips on Board) technology.
·Ultra-thin 35mm and super-light 4.5kg design.
·16:9 Golden aspect ratio , can easily achieve pixel to pixel 2K,4K,8K,16K resolution.
·CNC die-casting aluminum cabinet,splicing tolerance is controlled within ±0.1mm.
·All parts support front maintenance.
·Dot by dot calibration ensures color richness and brightness uniformity.